Localized haptic feedback
US7973769B2 · kind B2 · utility
21Cited by
3References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 29, 2006 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Nov 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2219/018
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface for generating an isolated haptic feedback includes an isolated region having a perimeter and a gap surrounding the perimeter, with the gap separating the isolated region from the rest of the surface. The surface further includes a deformable sealing material that is filled within the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.