Microphone with dust-proof section
US7974430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Dec 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/086
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In order to automate a microphone assembly process including a dust-proof treatment, an object of the present invention is to provide a dust-proof microphone having a configuration suitable for automated assembly.According to the present invention, a microphone has a plate-like or film-like dust-proof section that is disposed in a conductive housing (capsule) having a sound aperture and covers the sound aperture. The dust-proof section has a plurality of pores at least in a region corresponding to the sound aperture, and the dust-proof section further has a nonporous region. In the case of an electret condenser microphone, from the viewpoint of performance of the microphone, the dust-proof section is conductive. In addition, taking into account a soldering in a reflow furnace, the dust-proof section is heat-resistant. Each pore is desirably designed taking into account the environment for the usage of the microphone. However, if it is supposed that the microphone is used near one's mouth, each pore has an area of 0.01 mm2 or less. In addition, to enhance the dust-proof effect, the pores may be subjected to a water-repellent treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.