Method of making a land-grid-array (LGA) interposer
US7975379B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Aug 11, 2009 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Aug 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.