Metallization process for making fuser members
US7976692B2 · kind B2 · utility
7Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2008 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Oct 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal seeding or special substrate treatment. In embodiments, a metallized substrate, formed via a polycatecholamine-assisted metallization process, is used for the complete fabrication of the fuser member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.