Method of encapsulating optoelectronic components

US7976750B2 · kind B2 · utility

Assignee

• tesa SE · DE

Inventors

• Axel Burmeister · Hamburg, DE
• Franziska Zmarsly · Hamburg, DE

Key dates

• Filing date: May 8, 2009
• Grant date: Jul 12, 2011
• Expiry date: May 8, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/50
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.