High throughput processes and systems for barrier film deposition and/or encapsulation of optoelectronic devices
US7976908B2 · kind B2 · utility
2Cited by
7References
6Claims
0Family size
Assignee
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Key dates
| Filing date | May 16, 2008 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Jul 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/2437
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Processes for simultaneously encapsulating multiple optoelectronic devices and/or depositing a barrier film onto multiple substrates suitable for fabrication of optoelectronic devices thereon include the use of a plasma deposition apparatus having multiple pairs of opposing electrodes for deposition of reactants onto the substrate that is used to form the device or the complete device itself. The processes significantly reduce tact time relative to one at a time batch processing that is currently used for manufacturing optoelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.