Non-fibrous high modulus ultra high molecular weight polyethylene tape for ballistic applications
US7976930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2007 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Apr 22, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2623
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.