Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape
US7976932B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2009 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | May 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2623
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A ballistic resistant panel including a strike face portion and a backing portion. The strike face portion includes a plurality of interleaved layers of non-fibrous ultra high molecular weight polyethylene tape. The backing portion includes a plurality of interleaved layers of cross-plied fibers of ultra high molecular weight polyethylene. The entire stack of interleaved layers is compressed at high temperature and pressure to form a ballistic resistant panel having a strike face on one side. It has been found that ballistic resistance increases as the weight ratio of the strike face portion with respect to the backing portion decreases. A composite panel having a strike face Tensylon tape with at most 40% of the total weight of the panel exhibits improved ballistic resistance properties as compared to a monolithic structure of strictly interleaved layers of cross-plied high modulus fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.