Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet
US7976952B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2006 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Apr 15, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31573
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
To provide a pressure-sensitive adhesive sheet used during processing articles such as semiconductor wafers and laminate sheet used for such a pressure-sensitive adhesive sheet, which does not contaminate or break the semiconductor wafers during the processing and can minimize the curl of the articles due to residual stress of the pressure-sensitive adhesive sheet, a multi-layer sheet includes a composite film containing a urethane polymer and a vinyl-based polymer as effective components and a first film made of a material different from that of the composite film, wherein the urethane polymer is formed from a polyolefin diol and a polyisocyanate. A pressure-sensitive adhesive sheet is obtained by providing a pressure-sensitive adhesive layer on at least one side of the multi-layer sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.