Photosensitive resin composition, photosensitive resin laminate, and method for pattern forming
US7977030B2 · kind B2 · utility
2Cited by
1References
5Claims
0Family size
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Key dates
| Filing date | Jun 10, 2008 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Jun 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/127
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition, a photosensitive resin laminate, and a method for forming a pattern capable of realizing high hardness while using an epoxy group-containing acrylic resin are provided. In a photosensitive resin composition including (A) an epoxy group-containing acrylic resin, (B) a photopolymerization initiator, and (C) a sensitizer, an onium salt having a specific structure is used as the component (B), and at least one kind selected from 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and 2,6-dihydroxynaphthalene is used as the component (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.