Patent · US Active

Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

US7977395B2 · kind B2 · utility

5Cited by

2References

10Claims

0Family size

Assignee

UCHICAGO ARGONNE, LLC · US

Inventors

YuPo J. Lin · Westmont, US
Michael P. Henry · Batavia, US
Seth W. Snyder · Providence, US

Key dates

Filing date	Oct 21, 2008
Grant date	Jul 12, 2011
Priority date	—
Expiry date	Jan 20, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01B1/24
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.