Photosensitive resin composition
US7977400B2 · kind B2 · utility
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Key dates
| Filing date | Mar 14, 2006 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Jul 14, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0757
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Using a photosensitive resin composition comprising a polyimide (a) having, at the end of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, an unsaturated bond-containing polymerizable compound (b1) represented by the general formula (1), and a photopolymerization initiator (c), it is possible to conduct alkaline development and to form a polyimide film having excellent heat resistance, strength and elongation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.