Flexible multilayer printed circuit assembly with reduced EMI emissions
US7977582B2 · kind B2 · utility
4Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2008 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Apr 6, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible multilayer printed circuit assembly with shield fences. The flexible multilayer printed circuit assembly with multiple conductive layers includes logic ground vias that connect logic ground plane layers together, and shield vias that connect a top and a bottom shield plane layer together. Each of the shield fences is formed between the shield vias on an outside perimeter of each of the conductive layers. Each of the shield fences contains the logic ground vias inside, and also contains each corresponding conductive layer in the horizontal direction to which each layer extends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.