Systems and methods for providing localized heat treatment of metal components
US7977611B2 · kind B2 · utility
2Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2007 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Dec 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24471
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Systems and methods for providing localized heat treatment of metal components are provided. In this regard, a representative method includes: identifying a portion of a metal component to which localized heat treatment is to be performed; shielding an area in a vicinity of the portion of the metal component; and directing electromagnetic energy in the infrared (IR) spectrum toward the portion of the metal component such that the portion is heated to a desired temperature and such that the area in the vicinity of the portion that is subjected to shielding does not heat to the temperature desired for the heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.