Planar surface acoustic wave device, communication module, and communication apparatus
US7977848B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2010 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Feb 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An acoustic wave device of the present application includes a piezoelectric substrate (14), interdigital transducer electrodes (13) formed on the piezoelectric substrate (14), and an SiO2 film (12) formed so as to cover the electrodes (13). The acoustic wave device also includes a displacement adjustment film (11) formed on the SiO2 film (12), and the displacement adjustment film (11) is formed from a substance whose acoustic velocity is slower than that of the substance forming the SiO2 film (12). According to this configuration, it is possible to suppress unnecessary waves as well as improve temperature characteristics. Also, by mounting such an acoustic wave device in a communication module or communication apparatus, it is possible to achieve an improvement in reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.