In-mould molding touch module and method for manufacturing the same
US7977953B2 · kind B2 · utility
35Cited by
1References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2007 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Dec 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49105
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.