Patch panel with modules

US7978480B2 · kind B2 · utility

Assignee

• ADC Telecommunications, Inc. · US

Inventors

• Joseph C. Coffey · Burnsville, US
• John Schmidt · Minneapolis, US
• Bruce Ogren · Edina, US
• Karl Jacob Peterson · Tauranga, NZ

Key dates

• Filing date: Mar 15, 2007
• Grant date: Jul 12, 2011
• Expiry date: Mar 15, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49195
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

A patch panel includes a back plane having front mounted pairs of termination locations, and an interconnect location electrically connected to each pair of termination locations. The termination locations connect to two patch cords. The interconnect location defines an access device for selectively accessing the termination locations. An interconnect module interfaces with the interconnect location. The module can include test access, power over Ethernet, or circuit protection features.