Fracture prediction for crystalline microstructures
US7979237B2 · kind B2 · utility
1Cited by
3References
20Claims
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Key dates
| Filing date | May 7, 2008 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Apr 2, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2111/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for predicting failures in crystalline microstructures is described. Fracture stress distribution data obtained from test samples prepared according to the same manufacturing process as a contemplated device is used to characterize the strength of surfaces in a numerical stress analysis of the device. The reliability is then calculated for surface nodes on the device. The product of all such reliabilities yields the overall reliability (or 1—the overall failure probability) of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.