Method of manufacturing fluid ejection device with dry-film photo-resist layer
US7979987B2 · kind B2 · utility
2Cited by
21References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2007 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Oct 2, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a fluid ejection device includes providing a barrier layer and an orifice layer on a substrate, laminating a layer of photo-resist over a substantially planar surface of the orifice layer, forming an orifice in the orifice layer, and forming a counterbore in the layer of photo-resist, with forming a counterbore in the layer of photo-resist including exposing a portion of the substantially planar surface of the orifice layer within the counterbore.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.