Thermally controlled process interface
US7980481B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2004 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Jul 11, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/6851
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A field device is coupled to a process through at least one process interface element. The process interface element may be a field device flange, a manifold, or a process flange. The process interface element has a temperature sensor attached thereto, and is adapted to receive a thermal source. In one embodiment, the thermal source is one or more electrical heaters. In another embodiment, the thermal source is thermal transfer fluid tracing through the process interface element. A controller is coupled to the temperature sensor and is adapted to control the heat applied to the process interface element based upon the temperature of the process interface element measured by the temperature sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.