Droplet applying apparatus, method for measuring gap of droplet ejecting section and method for adjusting gap of droplet ejecting section
US7980645B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2007 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Mar 28, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13415
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A droplet applying apparatus includes a base 11 having a mounting surface 11a on which a substrate 10 is to be mounted, beam members 41, 42 which are fitted to the base 11 so as to be movable relative to the base 11 in the arrow A direction, a plurality of droplet ejecting sections 6 which are fitted to the beam members 41, 42 so as to be movable in the arrow B direction and which eject droplets to the substrate 10 mounted on the mounting surface 11a, reference members each of which is provided at a site of the beam members 41, 42 proximate to the ejecting surface of each droplet ejecting section 6 and whose distance to the mounting surface 11a is known, a distance measuring section 14 for measuring a distance to the ejecting surface of each droplet ejecting section 6 and a distance to each reference member, and a calculation section 15 for, based on a distance between the ejecting surface of the one droplet ejecting section 6 and the distance measuring section 14 as well as a distance between the one reference member and the distance measuring section 14, both measured by the distance measuring section 14, plus a known distance between the one reference member and the mounting sur…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.