Printed circuit board flexible interconnect design
US7980863B1 · kind B1 · utility
59Cited by
23References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2009 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Feb 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, a circuit board interconnect may include one or more of the following features: (a) a first circuit board having a plated through hole within a metal pad on the circuit board, the through hole providing a passage for solder to connect the first circuit board to a second circuit board, (b) a second circuit board having a metal pad able to couple to the first circuit board in an overlapping fashion when solder is passed through the plated through hole, and (c) a non-conductive solder repelling material on a surface of one circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.