Electroless pure palladium plating solution
US7981202B2 · kind B2 · utility
3Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2007 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Feb 28, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/42
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.