Photoresist composition and method of manufacturing a display substrate using the same
US7981706B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 28, 2010 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Sep 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/948
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist composition includes an alkali-soluble resin, a dissolution inhibitor including a quinone diazide compound, a first additive including a benzenol compound represented by the following Chemical Formula 1, a second additive including an acrylic copolymer represented by the following Chemical Formula 2 and an organic solvent. Accordingly, heat resistance of a photoresist pattern may be improved, and the photoresist pattern may be readily stripped. As a result, crack formation in the photoresist pattern may be reduced and/or prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.