Substrate bonding with bonding material having rare earth metal
US7981765B2 · kind B2 · utility
3Cited by
52References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2009 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Jul 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.