Power semiconductor module
US7982299B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 13, 2008 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | May 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Included are a semiconductor package, a first bus bar, a second bus bar and a soldering control unit. The semiconductor package includes a power semiconductor element, a first electrode plate and a second electrode plate. The first bus bar is a conductive member which is soldered onto the main surface of the first electrode plate through a first solder member. The second bus bar is a conductive member which is soldered onto the main surface of the second electrode plate through a second solder member. The soldering control unit is provided on each of the main surface of the first bus bar to which the first electrode plate is soldered and the main surface of the second bus bar to which the second electrode plate is soldered, and controls the solder joint thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.