Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
US7982317B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 25, 2009 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Jan 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device can include a plurality of semiconductor elements. The characteristics of each of the semiconductor elements can be easily tested during the production of the semiconductor device or when a failure occurs after the semiconductor device is mounted on a substrate, so that the quality can be well managed and a failure can be reliably analyzed. When not mounted on the substrate, the semiconductor device can have a connection structure in which the plurality of semiconductor elements are electrically independent of each other, so that their characteristics can be tested and analyzed by independently energizing the semiconductor elements. In a semiconductor device module having the semiconductor device mounted thereon, the connection structure can include a parallel circuit of the plurality of semiconductor elements. Therefore, all the semiconductor elements can be driven by applying a voltage between a pair of solder-bonding electrode pads disposed on the semiconductor device-mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.