Method and structure for RF antenna module
US7982684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2006 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | May 12, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method and structure for a microwave antenna module is provided. The method includes, creating a laminate structure by laminating a plurality of conductive layers and dielectric layers; creating a plurality of layers within the laminate structure to interconnect the plurality of conductive layers and dielectric layers; laminating a base plate to a bottom of the laminate structure; wherein the baseplate operates as a heat sink; and laminating a seal ring to a top periphery of the laminate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.