Haptic profiling system and method
US7982711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2004 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Dec 10, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/016
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a characterization module configured to receive data associated with operational characteristics of a mechanical device, the operational characteristics being associated with a perceptual experience of the mechanical device. A conversion module is coupled to the characterization module. The conversion module is configured to automatically produce, substantially without user intervention, a parametric data set associated with the mechanical device based on the data. In another embodiment, a method includes receiving data associated with operational characteristics of a mechanical device. The operational characteristics are associated with a perceptual experience of the mechanical device. A parametric data set associated with the mechanical device is produced automatically, without user intervention. The parametric data set is associated with the mechanical device based on the data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.