Thermal management system and method for thin membrane type antennas
US7983042B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2004 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | May 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to an embodiment of the present invention, a thermal management system for electronic components includes a plurality of spacers disposed between a first flexible substrate and a second flexible substrate to form a plurality of heat transfer regions each having a plurality of capillary pumping regions, a two-phase fluid disposed between at least one pair of adjacent spacers, and a plurality of electronic components coupled to a mounting surface of the first flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.