RF heater arrangement for substrate heating apparatus
US7985295B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2007 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Jan 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An RF heating system for a substrate or substrates including a susceptor for supporting the substrate; one or more RF heating coils; and a platen disposed between the RF heating coil and the substrate. The platen is constructed of materials that become heated under RF energy, which will then radiate heat into the susceptor and the substrate. In this way the susceptor need not be constructed of materials that become heated under RF energy thus minimizing levitation. The platen provides a uniform temperature profile across the substrates, benefiting from a more diffused heat source. The RF heating system may also be utilized in CVD apparatus that deposits materials on a continuous tape or roll.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.