Process for the manufacturing of decorative boards
US7985444B2 · kind B2 · utility
5Cited by
24References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2002 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Jun 8, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2401/32
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process of the manufacturing of decorative boards with an abrasion resistant surface and edges with joining functionality. This process includes the steps of a) cutting a carrier board to the desired dimension and molding edges with joining functionality, b) treating at least the upper surface of the board, c) applying radiation curable dry acrylic lacquer powder by means of electrostatic spray nozzles, d) heating the acrylic lacquer so that it melts, and e) curing the acrylic lacquer by UV- or electron beam radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.