Chip-type LED and method for manufacturing the same
US7985980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2008 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Jun 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
In a chip-type LED according to an embodiment of the present invention, a first recess hole for mounting an LED chip and a second recess hole for connecting a fine metal wire are formed in an insulating substrate, a metal sheet serving as a first wiring pattern is formed at a portion that includes the first recess hole, a metal sheet serving as a second wiring pattern is formed at a portion that includes the second recess hole, an LED chip is mounted on the metal sheet within the first recess hole, the LED chip is electrically connected to the metal sheet within the second recess hole via a fine metal wire, the LED chip including the first recess hole and the fine metal wire including the second recess hole are encapsulated in a first transparent resin that contains a fluorescent material, a surface of the insulating substrate including the first transparent resin is encapsulated in a second transparent resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.