Encapsulated metal resistor
US7986027B2 · kind B2 · utility
2Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2006 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | May 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method provides a semiconductor structure and method for forming such a structure that provides for protection for resistive layers formed within the structure from contamination from adjacent layers. By encapsulating the resistive layer in a material that is resistant to the diffusion of contaminants it is possible to protect the resistive material during the processing required to manufacture the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.