Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the same
US7986050B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2009 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Jan 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C): in which n is a positive number,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.