Method and apparatus for automated rule-based sourcing of substrate microfabrication defects
US7987150B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2007 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Nov 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Automated defect sourcing systems identify root-causes of yield excursions due to contamination, process faults, equipment failure and/or handling. They perform this function in timely manner and provide accurate and timely feedback to address and contain the sources of yield excursion. A signature repository stores known wafer surface manufacturing defect types as set of rules. The signature of a manufacturing defect pattern is associated with the equipment or process that causes the defects, and is used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature rule-based engine matches wafer defects against the signature repository during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.