Micro-structured cooler and use thereof

US7987899B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Olaf Kurtz · Berlin, DE
• Ralph Herber · Mainz, DE
• Peter Prechtl · Munich, DE
• Sven Theisen · Starnberg, DE
• Markus Hohn · Oberhaching, DE

Key dates

• Filing date: Jul 12, 2006
• Grant date: Aug 2, 2011
• Expiry date: Dec 3, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 μm, a depth t ranging from 30 to 150 μm, a mean spacing s ranging from 30 to 300 μm, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 μm and said base plate (5) having a thickness g ranging from 100 to 1,000 μm.