Interconnecting microfluidic package and fabrication method
US7988902B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2009 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Jul 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/2224
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A one-piece, microfluidic package with standardized multiple ports allows devices to be connected in series without resorting to extra tubing connections or bonding processes. The one-piece construction consists of microfluidic channels that can be connected to fluid reservoirs and other fluidic components fabricated with interconnecting and interlocking ports. The size of the friction-fit interlocking ports is designed such that the smaller male port fits snugly into the larger female port in a manner that is leak-free and adhesive-free. The friction-fit ports can also be reconfigured. Thus, the interconnection of microfluidic packages can be in an extended series including connections to sensors and devices such as a bio/biochemical/chemical sensor chip, a dielectrophoretic manipulator chip, and a microfluidic reactor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.