Vaporizing material at a uniform rate
US7989021B2 · kind B2 · utility
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2References
10Claims
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Assignee
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Key dates
| Filing date | Jul 27, 2005 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Apr 17, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/246
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of vaporizing material at a uniform rate for forming a layer on a substrate includes feeding a column of vaporizable material from a temperature controlled region maintained below the vaporizable material's effective vaporization temperature to a source of vaporization energy, wherein the volume of the column can vary during vaporization; and providing a source of vaporization energy delivering a constant heat flux to the surface of the column so that a uniform volume per unit time of the vaporizable material is vaporized to form the layer on the substrate, irrespective of the feeding rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.