Reduced porosity copper deposition
US7989029B1 · kind B1 · utility
5Cited by
28References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2008 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Oct 28, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.