Silicone resin and silicone composition
US7989030B2 · kind B2 · utility
4Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2007 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Sep 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02337
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silicone resin containing boron, aluminum, and/or titanium, and having silicon-bonded branched alkoxy groups; a silicone composition containing a silicone resin; and a method of preparing a coated substrate comprising applying a silicone composition on a substrate to form a film and pyrolyzing the silicone resin of the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.