Patent · US Active

Building slab, floor panels in particular, and method of manufacturing the same

US7989050B2 · kind B2 · utility

1Cited by

2References

17Claims

0Family size

Assignee

Kronotec AG · CH

Inventors

Joachim Hasch · Berlin, DE
Dirk Grunwald · Braunschweig, DE

Key dates

Filing date	Apr 17, 2008
Grant date	Aug 2, 2011
Priority date	—
Expiry date	Sep 19, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31989
WIPO fieldOther consumer goods
WIPO sectorOther fields

Abstract

A building board, in particular a flooring panel, with a core comprising at least one upper layer and one lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another, which is provided on at least its top side with a pattern that is covered with a sealing coat and in which sealing coat a structure corresponding to the pattern is embossed, is characterized in that at least the chips of the upper layer are glued with an adhesive having thermoplastic properties, and the upper layer has recesses formed at least directly beneath the pattern.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.