Insert-molded cover and method for manufacturing same
US7989079B2 · kind B2 · utility
12Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2008 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Oct 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An exemplary insert-molded cover (10) for electronic devices includes a metallic body (11), a plastic antenna lid (12) integrally formed with the metallic body and an oxide film (12) formed on a surface (111) of the metallic body for attaching the plastic antenna lid. The present invention also relates a method for manufacturing the insert-molded cover for electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.