Small form factor molded memory card and a method thereof
US7989268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2009 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Jul 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.