Method and apparatus for creating RFID devices

US7989313B2 · kind B2 · utility

Assignee

• Avery Dennison Corporation · US

Inventors

• Haochuan Wang · La Cañada Flintridge, US
• Ali R. Mehrabi · Glendale, US
• Kouroche Kian · Altadena, US
• Dave Edwards · Phoenix, US
• Akiko Tanabe · Los Angeles, US
• Mark Licon · Diamond Bar, US
• Jay Akhave · Claremont, US

Key dates

• Filing date: Apr 16, 2008
• Grant date: Aug 2, 2011
• Expiry date: May 14, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/07811
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.