Patent · US Active

Method for processing materials with laser pulses having a large spectral bandwidth

US7989731B2 · kind B2 · utility

10Cited by

28References

23Claims

0Family size

Assignee

Carl Zeiss Meditec AG · DE

Inventors

Mark Bischoff · Jena, DE
Martin Hacker · Jena, DE
Roland Sauerbrey · Dresden, DE
Gregor Stobrawa · Jena, DE
Wolfgang Ziegler · Waldbronn, DE

Key dates

Filing date	Jul 20, 2004
Grant date	Aug 2, 2011
Priority date	—
Expiry date	Jan 27, 2028

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/064
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.