Method and apparatus for using light emitting diodes
US7989839B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 1, 2010 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Mar 1, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8586
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.