Spring connector for making electrical contact at semiconductor scales
US7989945B2 · kind B2 · utility
17Cited by
241References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2007 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Jan 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/326
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.