Electronic device with heat dissipating structure
US7990704B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 8, 2009 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Dec 8, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a first and a second air passages. A first and a second electronic components locate in the first and second air passages, respectively. A first heat sink includes a first heat dissipation portion contacting the first electronic component and located in the first air passage and a second heat dissipation portion located in the second air passage. A second heat sink includes a first heat dissipation portion contacting the second electronic component and located in the second air passage and a second heat dissipation portion located in the first air passage. The first heat dissipation portion of the first heat sink aligns with the second heat dissipation portion of the second heat sink and the second heat dissipation portion of the first heat sink aligns with the first heat dissipation portion of the second heat sink along a flowing direction of the t air passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.