Heat dissipation device and method for manufacturing the same
US7990713B2 · kind B2 · utility
10Cited by
8References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 10, 2009 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Sep 27, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.